专业英语(自动化)(江汉大学)1450768617mooc慕课答案2026年版满分测试WYC


2020-02-17到2020-04-06

6 The Package Technology of IC 第二单元测验

1、 The first integrated circuit was invented by ( )

A:Thomas Edison
B: Jack Kilby and Robert Noyce
C: Newton
D:Albert Einstein
答案: Jack Kilby and Robert Noyce

2、 Wafer preparation excludes

A:cleaning
B:layering
C:probing
D: doping
答案: doping

3、 The process of photolithography excludes ( )

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专业英语(自动化)(江汉大学)1450768617mooc慕课答案2026年版满分测试WYC


2020-02-17到2020-04-06

6 The Package Technology of IC 第二单元测验

1、 The first integrated circuit was invented by ( )

A:Thomas Edison
B: Jack Kilby and Robert Noyce
C: Newton
D:Albert Einstein
答案: Jack Kilby and Robert Noyce

2、 Wafer preparation excludes

A:cleaning
B:layering
C:probing
D: doping
答案: doping

3、 The process of photolithography excludes ( )

点我阅读全文