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起止时间:2020-02-17到2020-07-15
更新状态:已完结
6 The Package Technology of IC 单元测验
1、 The first integrated circuit was invented by ( )
A:Thomas Edison
B: Jack Kilby and Robert Noyce
C: Newton
D:Albert Einstein
答案: Jack Kilby and Robert Noyce
2、 Wafer preparation excludes
A:cleaning
B:layering
C:probing
D: doping
答案: doping
3、 The process of photolithography excludes ( )
A:coating
B: soft bake
C: slicing
D: develop
答案: slicing
4、 Doping excludes（ ）
A:diffusion
B:rounding
C:ion-implant
D:
答案: rounding
5、 Functions of IC packaging excludes ( )
A: protection from the environment/handling
B:signal interconnections
C: slicing
D: heat dissipation
答案: slicing
6、 Which of the following statements is wrong? ( )
A: DIP, dual in-line package
B: SIP, single in-line package
C: PLCC, plastic in-line chip carrier
D:QFP, quad flat package
答案: PLCC, plastic in-line chip carrier
7、 Die attach is the physical attachment of the die to ( ) or substrate
A:lead frame
B:wafer
C: metal
D:base
答案: lead frame
8、 The three basic types of wire bonding excludes ( )
A:thermo compression
B:ultrasonic bonding
C:thermo ultrasonic bonding
D:thermo sonic ball bonding
答案: thermo ultrasonic bonding
9、 Tape automated bonding (TAB) uses a plastic tape as a ( )
A:substrate
B: wafer
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